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| 序號 | 測試項目 | 縮寫 | 樣品數/批 | 批數 | 測試方法 |
| 1 | Pre- and Post-Stress Electrical and Photometric Test | TEST | 所有應力試驗前后均進行測試 | 用戶規(guī)范或供應商的標準規(guī)范 | |
| 2 | Pre-conditioning | PC | SMD產品在7、8、9和10試驗前預處理 | JESD22-A113 | |
| 3 | External Visual | EV | 每項試驗前后均進行測試 | JESD22-B101 | |
| 4 | Parametric Verification | PV | 25 | 3 Note A | 用戶規(guī)范 |
| 5 | High Temperature Reverse Bias |
HTRB | 77 | 3 Note B | MIL-STD-750-1 M1038 Method A |
| 5a | AC blocking voltage |
ACBV | 77 | 3 Note B | MIL-STD-750-1 M1040 Test Condition A |
| 5b | High Temperature Forward Bias |
HTFB | 77 | 3 Note B | JESD22 A-108 |
| 5c | Steady State Operational |
SSOP | 77 | 3 Note B | MIL-STD-750-1 M1038 Condition B（Zeners） |
| 6 | High Temperature Gate Bias |
HTGB | 77 | 3 Note B | JESD22 A-108 |
| 7 | Temperature Cycling |
TC | 77 | 3 Note B | JESD22 A-104 Appendix 6 |
| 7a | Temperature Cycling Hot Test |
TCHT | 77 | 3 Note B | JESD22 A-104 Appendix 6 |
| 7a alt |
TC Delamination Test |
TCDT | 77 | 3 Note B | JESD22 A-104 Appendix 6 J-STD-035 |
| 7b | Wire Bond Integrity | WBI | 5 | 3 Note B | MIL-STD-750 Method 2037 |
| 8 | Unbiased Highly Accelerated Stress Test |
UHAST | 77 | 3 Note B | JESD22 A-118 |
| 8 alt |
Autoclave | AC | 77 | 3 Note B | JESD22 A-102 |
| 9 | Highly Accelerated Stress Test |
HAST | 77 | 3 Note B | JESD22 A-110 |
| 9 alt |
High Humidity High Temp. Reverse Bias |
H3TRB | 77 | 3 Note B | JESD22 A-101 |
| 10 | Intermittent Operational Life |
IOL | 77 | 3 Note B | MIL-STD-750 Method 1037 |
| 10 alt |
Power and Temperature Cycle |
PTC | 77 | 3 Note B | JESD22 A-105 |
| 11 | ESD Characterization |
ESD | 30 HBM | 1 | AEC-Q101-001 |
| 30 CDM | 1 | AEC-Q101-005 | |||
| 12 | Destructive Physical Analysis |
DPA | 2 | 1 NoteB | AEC-Q101-004 Section 4 |
| 13 | Physical Dimension |
PD | 30 | 1 | JESD22 B-100 |
| 14 | Terminal Strength | TS | 30 | 1 | MIL-STD-750 Method 2036 |
| 15 | Resistance to Solvents |
RTS | 30 | 1 | JESD22 B-107 |
| 16 | Constant Acceleration | CA | 30 | 1 | MIL-STD-750 Method 2006 |
| 17 | Vibration Variable Frequency |
VVF | 項目16至19是密封包裝的順序測試。 （請參閱圖例頁面上的注釋H.） | JEDEC JESD22-B103 |
|
| 18 | Mechanical Shock |
MS | JEDEC JESD22-B104 |
||
| 19 | Hermeticity | HER | JESD22-A109 | ||
| 20 | Resistance to Solder Heat |
RSH | 30 | 1 | JESD22 A-111 (SMD) B-106 (PTH) |
| 21 | Solderability | SD | 10 | 1 Note B | J-STD-002 JESD22B102 |
| 22 | Thermal Resistance |
TR | 10 | 1 | JESD24-3,24-4,26-6視情況而定 |
| 23 | Wire Bond Strength |
WBS | 最少5個器件的10條焊線 | 1 | MIL-STD-750 Method 2037 |
| 24 | Bond Shear | BS | 最少5個器件的10條焊線 | 1 | AEC-Q101-003 |
| 25 | Die Shear | DS | 5 | 1 | MIL-STD-750 |
| Method 2017 | |||||
| 26 | Unclamped Inductive Switching |
UIS | 5 | 1 | AEC-Q101-004 Section 2 |
| 27 | Dielectric Integrity | DI | 5 | 1 | AEC-Q101-004 Section 3 |
| 28 | Short Circuit Reliability Characterization |
SCR | 10 | 3 Note B | AEC-Q101-006 |
| 29 | Lead Free | LF | AEC-Q005 | ||
